Sampling of dermal Interstitial Fluid (dISF)

Technology

A needle chip optimized for sampling of dermal interstitial fluid designed by world leading MEMS expertise and manufactured in a tier one volume foundry using a combination of deep reactive ion etching and wet etching of silicon, as well as other MEMS processes.

The Challenge

Dermal interstitial fluid, as opposed to the bloodstream, is not under positive pressure. The fluid isn’t easy to sample. All parts of a system intended for sampling of dermal interstitial fluid need to be highly optimized and work in conjunction for an efficient sampling process.

Ascilion has spent over a decade refining every part of the system from the needle chip to the instrument controlling the process via the method for how the parts fit together with maintained sterility.

Dermal Interstitial Fluid

Biomarkers found in dermal interstitial fluid, a compartment close to cell activity, are often more relevant for analysis compared to those collected from blood sampling.
Dermal interstitial fluid is still largely unexplored because it has traditionally been very difficult to access. Furthermore, sampling processes have caused pain and discomfort, often resulting in an unwanted alteration of the content of the sample due to use of for instance local anesthesia or simply the invasive nature of the method.
This all changes with the simplicity of Ascilion’s microneedle system.

Hollow Silicon Microneedles

Microneedles made from monocrystalline silicon are at the core of Ascilion's dISF sampling solution. Multiple hollow microneedles, fabricated to form a precisely engineered pattern, are combined with a capillary system that enables robust sampling and collection of the fluid.
With a needle length of less than 0.5 mm, the sampling process is truly minimally invasive.

Integrated Capillary System

All needles are connected using an integrated capillary system that drives the fluid towards a collection reservoir. The capillaries are manufactured for optimal fluidic properties by a combination of deep reactive ion etching of silicon and anodic bonding of glass utilizing state of the art MEMS processing.

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Lorum ipsum dolor sit amet. Sed dium nonum nibb euismod tincidunt ut laorect dolore magna aliquam erat volutpat. Ust wist enim ad minim. Venium quis nostrud exertci tation. Lorum ipsum dolor sit amet. Sed dium nonum nibb euismod tincidunt ut laorect dolore magna aliquam erat volutpat.

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